Lidar works much like radar, but instead of sending out radio waves it emits pulses of infrared lightÑaka lasers invisible to the human eyeÑand measures how long they take to come back after hitting nearby objects.Scop...

Internet financing can help small businesses and startups that do not have access to bank lending and traditional financing resources in a good way.Scope of the Report:One countryÕs traditional finance sector which incl...

Crowdfunding is the practice of funding a project or venture by raising small amounts of money from a large number of people, typically via the Internet.Scope of the Report:Crowdfunding refers to the model that project s...

Intelligent vehicle technologies comprise electronic, electromechanical, and electromagnetic devices - usually silicon micromachined components operating in conjunction with computer-controlled devices and radio transcei...

Car insurance (also known as vehicle insurance, motor insurance or auto insurance) is insurance for cars, trucks, motorcycles, and other road vehicles.Scope of the Report:Car insurance's primary use is to provide financi...

Musical instruments are tools or devices that are used to create musical sounds. They are generally made of materials, such as wood, timber, metal, strings and synthetic materials.Scope of the Report:The increasing popul...

The global infant care product market includes products related to baby hair care, baby skin care, toiletries, convenience, cosmetics and baby safety.Scope of the Report:Rising in discretionary spending by parents, espec...

Integrated circuit design, or IC design, is a subset of electronics engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs.Scope of the Report:The grow...

A smart card, chip card, or integrated circuit card (ICC), is any pocket-sized card that has embedded integrated circuits.Scope of the Report:The major factors driving the growth of the smart card market include increasi...

Advanced electronic packages need to address the growing interconnect gap between IC and PCB, achieve a high level of functional integration, and meet form-factor, power, cost, and electrical performance requirements.Sco...