Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them. WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die.[1] Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment.
Wafer-level packaging consists of extending the wafer fab processes to include device interconnection and device protection processes. Most other kinds of packaging do wafer dicing first, and then put the individual die in a plastic package and attach the solder bumps. Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing.
There is no single industry-standard method of wafer-level packaging at present.
A major application area of WLPs are smartphones due to the size constraints.
Scope of the Report:This report focuses on the Wafer Level Packaging in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
The worldwide market for Wafer Level Packaging is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2025, from xx million US$ in 2020, according to a new study.
Market Segment by Manufacturers, this report covers Amkor Technology Inc
Fujitsu Ltd
Jiangsu Changjiang Electronics
Deca Technologies
Qualcomm Inc
Toshiba Corp
Tokyo Electron Ltd
Applied Materials, Inc
ASML Holding NV
Lam Research Corp
KLA-Tencor Corration
China Wafer Level CSP Co. Ltd
Marvell Technology Group Ltd
Siliconware Precision Industries
Nanium SA
STATS Chip
PAC Ltd
Market Segment by Regions, regional analysis covers North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers 3D TSV WLP
2.5D TSV WLP
WLCSP
Nano WLP
Others ( 2D TSV WLP and Compliant WLP)
Market Segment by Applications, can be divided into Electronics
IT & Telecommunication
Industrial
Automotive
Aerospace & Defense
Healthcare
Others (Media & Entertainment and Non-Conventional Energy Resources)
There are 15 Chapters to deeply display the global Wafer Level Packaging market.
Chapter 1, to describe Wafer Level Packaging Introduction, product scope, market overview, market opportunities, market risk, market driving force;
Chapter 2, to analyze the top manufacturers of Wafer Level Packaging, with sales, revenue, and price of Wafer Level Packaging, in 2018 and 2019;
Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2018 and 2019;
Chapter 4, to show the global market by regions, with sales, revenue and market share of Wafer Level Packaging, for each region, from 2015 to 2020;
Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;
Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2015 to 2020;
Chapter 12, Wafer Level Packaging market forecast, by regions, type and application, with sales and revenue, from 2020 to 2025;
Chapter 13, 14 and 15, to describe Wafer Level Packaging sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source
Frequently Asked Questions
The base year for the study has been considered 2019, historic year 2014 and 2018, the forecast period considered is from 2020 to 2027. The regions analyzed for the market include North America, Europe, South America, Asia Pacific, and Middle East and Africa. These regions are further analyzed at the country-level. The study also includes attractiveness analysis of type, application and regions which are benchmarked based on their market size, growth rate and attractiveness in terms of present and future opportunity for understanding the future growth of the market.
Market is segmented on the basis:
- By Type
- By Application
- By Region
- By Country
- By Manufacturer
The report offers in-depth analysis of driving factors, opportunities, restraints, and challenges for gaining the key insight of the market. The report emphasizes on all the key trends that play a vital role in the enlargement of the market from 2019 to 2026.
The report provides company profile of the key players operating in the market and a comparative analysis based on their business overviews industry offering, segment market share, regional presence, business strategies, innovations, mergers & acquisitions, recent developments, joint venture, collaborations, partnerships, SWOT analysis, and key financial information.
