Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the die in a process called "Thermo Compression Bonding". The bumps are forced against their opposing pads and a second metallic bond is formed where the bond comes into contact with the package metallization. This technique typically requires the use of heat as high as 350¡ to 400¡C, and forces of as much as 100 g/bump.
Scope of the Report:Thermo Compression Bonding (TCB) is a chip attach technology under investigation and implementation in multiple platforms. The global Thermo Compression Bonder market is driven by increased Thermo Compression Bonder usage: memory applications currently, logic devices next. Meanwhile, Thermo Compression Bonder is gaining market share from wire bond assembly processes. Also, lower throughput coupled with higher processing costs was example of challenges in the TCB technology.
China Thermo Compression Bonder market is valued at $6.39 million in 2017 and is expected to reach $19.53 million by the end of 2023, growing at a CAGR of 20.47% between 2018 and 2023.
The worldwide market for Thermo Compression Bonder is expected to grow at a CAGR of roughly 24.8% over the next five years, will reach 120 million US$ in 2026, from 33 million US$ in 2020, according to a new Our study.
This report focuses on the Thermo Compression Bonder in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers ASMPT (AMICRA)
K&S
Besi
Shibaura
SET
Hanmi
Market Segment by Regions, regional analysis covers North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers Automatic Thermo Compression Bonder
Manual Thermo Compression Bonder
Market Segment by Applications, can be divided into IDMs
OSAT
The content of the study subjects, includes a total of 15 chapters:Chapter 1, to describe Thermo Compression Bonder product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Thermo Compression Bonder, with price, sales, revenue and global market share of Thermo Compression Bonder in 2018 and 2019.
Chapter 3, the Thermo Compression Bonder competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Thermo Compression Bonder breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2015 to 2020.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2015 to 2020.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2015 to 2020.
Chapter 12, Thermo Compression Bonder market forecast, by regions, type and application, with sales and revenue, from 2020 to 2026.
Chapter 13, 14 and 15, to describe Thermo Compression Bonder sales channel, distributors, customers, research findings and conclusion, appendix and data source.
Frequently Asked Questions
The base year for the study has been considered 2019, historic year 2014 and 2018, the forecast period considered is from 2020 to 2027. The regions analyzed for the market include North America, Europe, South America, Asia Pacific, and Middle East and Africa. These regions are further analyzed at the country-level. The study also includes attractiveness analysis of type, application and regions which are benchmarked based on their market size, growth rate and attractiveness in terms of present and future opportunity for understanding the future growth of the market.
Market is segmented on the basis:
- By Type
- By Application
- By Region
- By Country
- By Manufacturer
The report offers in-depth analysis of driving factors, opportunities, restraints, and challenges for gaining the key insight of the market. The report emphasizes on all the key trends that play a vital role in the enlargement of the market from 2019 to 2026.
The report provides company profile of the key players operating in the market and a comparative analysis based on their business overviews industry offering, segment market share, regional presence, business strategies, innovations, mergers & acquisitions, recent developments, joint venture, collaborations, partnerships, SWOT analysis, and key financial information.
